I had joined HCL Tech (isd) on 29th December 2014 and had signed a service agreement (joining bond) of 18 months. Now i am planning to resign inorder to pursue better opportunities and am concerned about bond liability. I am attaching the copy of service agreement and have the below concerns :
1)Am i correct to conclude 28th June 2016 to be the bond end date as per the bond agreement ?
2) Can i resign within bond period and serve the notice of 2 months ( in my case) such that the releasing date falls after the bond (would fall in July if i do it today)? Would this make me liable for bond breach or not ?
Please share your thoughts on my current dilemma...as i want to avoid any liablity due to ignorance. thanks
4th May 2016 From India, Delhi

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